TPU

Broadcom Reportedly Lines Up $60B AI Chip Financing as Anthropic Expands Compute

Bloomberg reported Broadcom's syndicate is raising $60B for AI chips and infrastructure, including a $42B Class A senior-secured tranche and an $18B junior tranche led by Blackstone, which is committing $9B. Reuters said Anthropic's IPO filing shows a Broadcom loan of up to $42B, covering about one-third of its five-year $125.2B TPU compute lease commitment. Anthropic is expected to become Broadcom's largest chip-design customer next year.