Broadcom CEO warns AI financing may become harder than chips

Broadcom CEO Hock Tan said wafer and memory supply constraints are easing, but rising costs of building systems for advanced AI models could make financing a bigger challenge than securing chips. He cited early talks on over $50 billion in debt financing to help OpenAI buy custom AI chips, up to $42 billion in lending to Anthropic, and a Reuters report that Anthropic could become Broadcom's largest chip-design customer in 2027.

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