Issue 2026-09-09 · Industry · 芯片 · 政策
ASML wins TSMC, Samsung, Intel; Huawei pursues alternatives
ASML convinced TSMC, Samsung and Intel to switch to larger photomasks, which should boost throughput of its newest EUV machines by about 40%. Meanwhile Huawei, via equipment maker Yuliangsheng and its suppliers, is pursuing a domestic strategy to reduce dependence on Dutch lithography technology.
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